Next Generation Electronics
With Active Devices

in Three Dimensions

Next Generation Electronics With Active Devices

in Three Dimensions

Publications

(30)

Khan, Asif Ali, and Jeronimo Castrillon. "LearnCNM2Predict: Transfer Learning-based Performance Model for CNM Systems." https://cfaed.tu-dresden.de/files/Images/people/chair-cc/publications/2507_daSilva_SAMOS.pdf

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Shadmehri, H. H.; Lanius, C.; Gemmeke, T. A (145, 128) DEC-TED BCH Decoder with Composite Field and Redundant Arithmetic. In 2025 IEEE Nordic Circuits and Systems Conference (NorCAS); IEEE: Riga, Latvia, 2025; pp 1–7. https://doi.org/10.1109/NorCAS66540.2025.11231200.

(28)

Sudarshan, C.; Artner, O.; Manea, P.; Siegel, S.; Hoffmann‐Eifert, S.; Dittmann, R.; Strachan, J. P. A Flexible and Energy‐Efficient Compute‐in‐Memory Accelerator for Kolmogorov–Arnold Networks. Advanced Intelligent Systems 2026, e202501220. https://doi.org/10.1002/aisy.202501220.

(27)

Fabrizi, F.; Goudarzi, S.; Khan, S.; Mohammad, T.; Starodubtceva, L.; Cegielski, P. J.; Thiel, F.; Özen, S.; Schiffer, M.; Lang, F.; Bolívar, P. H.; Riedl, T.; Müller-Newen, G.; Anantharaman, S. B.; Mohammadi, M.; Lemme, M. C. A Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration. ACS Nano 2025, 19 (33), 30428–30440. https://doi.org/10.1021/acsnano.5c10397.

(26)

de Lima, J. P. C.; Moghadam, M. S.; Aygun, S.; Castrillon, J.; Najafi, M. H.; Khan, A. A. All-in-Memory Stochastic Computing Using ReRAM. arXiv 2025. https://doi.org/10.48550/ARXIV.2504.08340.

(25)

Rudenko, T.; Gomeniuk, Y. V.; Slobodian, O.; Lytvyn, P.; Reato, E.; Esteki, A.; Lemme, M. C.; Nazarov, A. Application of Gate-to-Channel Capacitance Measurements for Extraction and Investigation of the Effective Mobility in MoS2 Field Effect Transistors with Hysteresis of Electrical Characteristics. Phys. Scr. 2026, 101 (10), 105909. https://doi.org/10.1088/1402-4896/ae4ae6.

(24)

Farzaneh, H.; Khan, A. A.; Castrillon, J. CoMoNM: A Cost Modeling Framework for Compute-Near-Memory Systems. arXiv 2025. https://doi.org/10.48550/ARXIV.2508.11451.

(23)

Castrillon, J. Compiler Support for Ferroelectric Compute-in-Memory Solutions (and Beyond), 205 AD.

(22)

De Lima, J. P. C.; Morris, B.; Khan, A. A.; Castrillon, J.; Jones, A. K. Count2Multiply: Reliable In-Memory High-Radix Counting. In 2026 IEEE International Symposium on High Performance Computer Architecture (HPCA); IEEE: Sydney, Australia, 2026; pp 1–15. https://doi.org/10.1109/HPCA68181.2026.11408436.

(21

Hu, X. S.; Lee, M.-Y.; Li, M.; Lima, J. P. C. D.; Liu, L.; Zhu, Z.; Castrillon, J.; Niemier, M.; Wang, Y. Cross-Layer Design and Design Automation for In-Memory Computing Based on Nonvolatile Memory Technologies. IEEE Des. Test 2025, 42 (6), 75–86. https://doi.org/10.1109/MDAT.2025.3603495.

(20)

Castrillon, J., Giceva, J., Hua, Y., Keeton, K., Shekar, A., Skadron, K., ... & Zhang, H. Declarative Memory Services. CIDR 2026. 16th Annual Conference on Innovative Data Systems Research (CIDR ’26). January 18-21, Chaminade, USA https://mail.vldb.org/cidrdb/papers/2026/p21-castrillon.pdf

(19)

Kavand, N.; Darjani, A.; Bhattacharjee, N.; Quijada, J. N.; Martinez, J. P.; Mikolajick, T.; Trommer, J.; Kumar, A. Design and Evaluation of an RFET Standard Cell Library Compatible with 22 Nm FDSOI. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 2026, 1–1. https://doi.org/10.1109/TCAD.2025.3649810.

(18)

De Lima, J. P. C.; Dietrich, M.; Castrillon, J.; Khan, A. A. Efficient In-Memory Acceleration of Sparse Block Diagonal LLMs. In 2025 Cross-Disciplinary Conference on Memory-Centric Computing (CCMCC); IEEE: Dresden, Germany, 2025; pp 1–8. https://doi.org/10.1109/CCMCC67628.2025.11380618.

(17)

Khan, S.; Goudarzi, S.; Schäffer, S.; Sonneveld, L.; Macco, B.; Ran, K.; Kurahashi, N.; Bolívar, P. H.; Ehrler, B.; Riedl, T.; Müller-Newen, G.; Anantharaman, Surendra. B.; Mohammadi, M.; Lemme, Max. C. Facile Synthesis and On-Chip Color Tuning of CsPbBr$_{3}$@CsPbBr$_{3-x}$TFA$_{x}$ Nanoplatelets via Ion Engineering. arXiv 2025. https://doi.org/10.48550/ARXIV.2509.16290.

(16)

Darjani, A.; Kavand, N.; Kumar, A. Flip-Break: Breaking Flip-Flop-Based Logic Locking in Sequential Circuits. In Proceedings of the Great Lakes Symposium on VLSI 2025; ACM: New Orleans LA USA, 2025; pp 463–469. https://doi.org/10.1145/3716368.3735189.

(15)

Darjani, A.; Kavand, N.; Kumar, A. Flip-UnLock: An Anomaly Detection Attack on Flip-Flop-Based Logic Locking. In 2025 IEEE Computer Society Annual Symposium on VLSI (ISVLSI); 2025; Vol. 1, pp 1–6. https://doi.org/10.1109/ISVLSI65124.2025.11130332.

(14)

Ullah, S.; Sahoo, S. S.; Li, C.; Li, C.; Liu, L.; Pereira, T. S.; Wen, B.; Yin, X.; Darjani, A.; Kavand, N.; Bodla, C.; Panduga, R. Y.; Holemadlu, A.; Maly, J.; Förste, J.; Vadia, S.; Hu, X. S.; Kumar, A. Invited Paper: Circuit and Architecture Design with Emerging Computing Paradigms. In 2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD); IEEE: Munich, Germany, 2025; pp 1–9. https://doi.org/10.1109/ICCAD66269.2025.11240725.

(13)

Sana Khan, Surendra B. Anantharaman, Maryam Mohammadi, Max C. Lemme, Monitoring Halide Exchange in Perovskite Films with Spectroscopic Ellipsometry, Proceedings of Emerging Light Emitting Materials 2025 (EMLEM25) La Canea, Greece, 2025 October 8th - 10th, Poster, https://www.nanoge.org/proceedings/EMLEM25/68c88be5d3083d187ce13720

(12)

Ascoli, A.; Gemo, E.; Corinto, F.; Bonnin, M.; Gilli, M.; Civalleri, P. P.; Demirkol, A. S.; Messaris, I.; Ntinas, V.; Prousalis, D.; Tetzlaff, R.; Slesazeck, S.; Mikolajick, T.; Chua, L. Ndr Effects in a Locally-Active Memristor Induce Small-Signal Amplification in a Simple Cell. In 2025 14th International Conference on Modern Circuits and Systems Technologies (MOCAST); IEEE: Dresden, Germany, 2025; pp 1–9. https://doi.org/10.1109/MOCAST65744.2025.11083728.

(11)

Makino, H.; Rellinghaus, B.; Schneider, S.; Lubk, A.; Pohl, D. Noise Estimation and Suppression in Quantitative EMCD Measurements. arXiv 2025. https://doi.org/10.48550/ARXIV.2510.24445.

(10)

Buczek, M.; Moos, Z.; Gutsche, A.; Menzel, S.; Dittmann, R. Pr 1– x Ca x MnO3 -Based Memristive Heterostructures: Basic Mechanisms and Applications. Chem. Rev. 2025, 125 (13), 6156–6202. https://doi.org/10.1021/acs.chemrev.4c00813.

(9)

Kavand, N.; Darjani, A.; Niranjan, T.; Kumar, A. RAT: RFET-Based Analog Hardware Trojan. In 2025 IEEE Computer Society Annual Symposium on VLSI (ISVLSI); IEEE: Kalamata, Greece, 2025; pp 1–6. https://doi.org/10.1109/ISVLSI65124.2025.11130296.

(8)

Schneider, S.; Beckert, S.; Hammer, R.; König, M.; Moldovan, G.; Pohl, D. STEM EBIC as a Quantitative Probe of Semiconductor Devices. arXiv 2025. https://doi.org/10.48550/ARXIV.2511.11528.

(7)

Darjani, A.; Kavand, N.; Han, Z.; Kumar, A. Structurally Secure Obfuscation: Assessing and Mitigating Structural Vulnerabilities in Circuits Obfuscation. ACM Trans. Des. Autom. Electron. Syst. 2026, 31 (1), 1–30. https://doi.org/10.1145/3772062.

(6)

Wang, S.; Li, Z.; Pei, M.; Ren, Q.; Deng, M.; Ang, K.-W.; Ascoli, A.; Banerjee, S.; Bonnin, M.; Van De Burgt, Y.; Cheng, B.; Chua, L.; Civalleri, P. P.; Corinto, F.; Cui, T. J.; Das, S.; Demirkol, A. S.; Van Dijken, S.; Fan, Y.; Fang, L.; Farronato, M.; Feng, Z. R.; Gemo, E.; Gilli, M.; Goswami, S.; He, Y.; Huang, C.; Huang, Q.; Hwang, C. S.; Ielmini, D.; Jang, Y. H.; Kuncic, Z.; Lemme, M. C.; Li, C.; Liang, S.-J.; Liu, K.; Liu, S.; Luo, J.; Ma, Q.; Maass, W.; Mannocci, P.; Messaris, I.; Miao, F.; Mikolajick, T.; Ntinas, V.; Ponis, J.; Prodromakis, T.; Prousalis, D.; Shao, Q.; Slesazeck, S.; Strachan, J. P.; Tan, H.; Tang, J.; Tetzlaff, R.; Tran, L. P. L.; Valov, I.; Vorias, A.; Wang, B.; Wang, J.; Wang, S.; Wang, X.; Wang, Y.; Wu, H.; Xia, Q.; Xiao, K.; Xiao, Z.; Xiong, Z.; Xu, T.; Yang, M.-J.; Yang, Y.; Yang, Y.; Zhang, W.; Chai, Y. Technology Roadmap of Bioinspired Computing Hardware. ACS Nano 2026, 20 (10), 8102–8163. https://doi.org/10.1021/acsnano.5c17087.

(5)

Aliagha, E.; Göhringer, D. Toward Domain-Aware Energy-Efficient Reconfigurable Architectures. In 2025 International Conference on Field Programmable Technology (ICFPT); IEEE: Shanghai, China, 2025; pp 280–281. https://doi.org/10.1109/ICFPT67023.2025.00055.

(4)

Li, D.; Zheng, W.; Ghorbani-Asl, M.; Scheiter, J.; Sobczak, K.; Kretschmer, S.; Polčák, J.; Jadhao, P. H.; Michałowski, P. P.; Yu, R.; Zhang, J.; Liu, J.; Du, J.; Guo, Q.; Zschech, E.; Šikola, T.; Bonn, M.; Pérez, N.; Nielsch, K.; Krasheninnikov, A. V.; Wang, H. I.; Yu, M.; Feng, X. Triphasic Synthesis of MXenes with Uniform and Controlled Halogen Terminations. Nat. Synth 2026. https://doi.org/10.1038/s44160-025-00970-w.

(3)

Khan, A. A.; Benmeziane, H.; Farzaneh, H.; Lima, J.; Simon, W.; Shi, Y.; Yan, Z.; Sebastian, A.; Hu, X. S.; Castrillon, J.; Lammie, C. Tutorial: Hardware-Aware Compilation and Simulation for In-Memory Computing. In Proceedings of the International Conference on Compilers, Architecture, and Synthesis for Embedded Systems; ACM: Taipei International Convention Center (TICC) Taipei Taiwan, 2025; pp 31–32. https://doi.org/10.1145/3742872.3758333.

(2)

Mohammadi, M.; Stoll, S. L.; Herrero, A. F.; Khan, S.; Fabrizi, F.; Gollwitzer, C.; Wang, Z.; Anantharaman, S. B.; Lemme, M. C. Wafer-Scale Synthesis of Mithrene and Its Application in 2D Heterostructure UV Photodetectors. arXiv 2025. https://doi.org/10.48550/ARXIV.2506.22535.

(1)

Rademacher, N.; Völkel, L.; Reato, E.; Otto, M.; Krotkus, S.; Mischke, J.; Yengel, E.; Mauder, C.; Henning, A.; Heuken, M.; Ran, K.; Mayer, J.; Lemme, M. C. Water-Based, Large-Scale Transfer of 2D Materials Grown on Sapphire Substrates. In Review November 25, 2025. https://doi.org/10.21203/rs.3.rs-7544328/v1.