Guest Talk: Juliana Panchenko "From Microinterconnects to Systems: Advanced Packaging Technologies for HPC and AI"

Last Friday, we welcomed Juliana Panchenko of Technische Universität Dresden for our latest Friday Get-together.
Juliana gave an inspiring overview of recent advances in fine-pitch interconnect technologies that enable advanced packaging solutions for high-performance computing (HPC) and artificial intelligence (AI) systems. The presentation covered recent developments and results in microbump and hybrid bonding technologies, highlighting their role in achieving higher interconnect density, improved performance, and enhanced system integration.

Thank you Juliana Panchenko for your talk. Initial collaborative talks have already taken place. We are looking forward to keep in touch.