Prof. Dr.-Ing. Juliana Panchenko

TU Dresden

Friday Get-together: “From Microinterconnects to Systems: Advanced Packaging Technologies for HPC and AI”

Dr. Stefan Wiefels

Forschungszentrum Jülich

From short- to long-term stability in VCM based RRAM

Dr.-Ing. habil. Lukas Lorenz

Fraunhofer IPMS

Friday Get-together: “Hochdichte Chipletsysteme dank quasi-monolithischer Integration”

ESSERC 2026 - European Solid-State Electronics Research Conference

MNE 2026 - 52nd International Conference on Micro and Nano Engineering